TL

Tzu-Hung Lin

ME Mediatek: 14 patents #6 of 483Top 2%
Overall (2019): #4,116 of 560,194Top 1%
14
Patents 2019

Issued Patents 2019

Patent #TitleCo-InventorsDate
10497689 Semiconductor package assembly and method for forming the same Chia-Cheng Chang, I-Hsuan Peng 2019-12-03
10483211 Fan-out package structure and method for forming the same I-Hsuan Peng, Ching-Wen Hsiao, Nai-Wei Liu, Wei-Che Huang 2019-11-19
10468341 Semiconductor package assembly Nai-Wei Liu, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang 2019-11-05
10431564 Structure and formation method of chip package structure 2019-10-01
10424563 Semiconductor package assembly and method for forming the same I-Hsuan Peng, Ching-Wen Hsiao 2019-09-24
10410969 Semiconductor package assembly Chia-Cheng Chang, I-Hsuan Peng 2019-09-10
10361173 Semiconductor package assemblies with system-on-chip (SOC) packages Ming-Tzong Yang 2019-07-23
10354970 Flip chip package utilizing trace bump trace interconnection Thomas Matthew Gregorich 2019-07-16
10332830 Semiconductor package assembly Ming-Tzong Yang, Wei-Che Huang 2019-06-25
10256210 Semiconductor package structure and method for forming the same Ching-Wen Hsiao, I-Hsuan Peng 2019-04-09
10217724 Semiconductor package assembly with embedded IPD I-Hsuan Peng, Ching-Wen Hsiao 2019-02-26
10217723 Semiconductor package with improved bandwidth I-Hsuan Peng, Nai-Wei Liu, Wei-Che Huang 2019-02-26
10199318 Semiconductor package assembly Nai-Wei Liu, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou, Wei-Che Huang 2019-02-05
10177125 Semiconductor package assembly I-Hsuan Peng, Ching-Wen Hsiao 2019-01-08