Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354970 | Flip chip package utilizing trace bump trace interconnection | Tzu-Hung Lin | 2019-07-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354970 | Flip chip package utilizing trace bump trace interconnection | Tzu-Hung Lin | 2019-07-16 |