Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483211 | Fan-out package structure and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng, Ching-Wen Hsiao, Nai-Wei Liu | 2019-11-19 |
| 10468341 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou | 2019-11-05 |
| 10332830 | Semiconductor package assembly | Ming-Tzong Yang, Tzu-Hung Lin | 2019-06-25 |
| 10217723 | Semiconductor package with improved bandwidth | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu | 2019-02-26 |
| 10199318 | Semiconductor package assembly | Nai-Wei Liu, Tzu-Hung Lin, I-Hsuan Peng, Che-Hung Kuo, Che-Ya Chou | 2019-02-05 |