Issued Patents 2019
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340253 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2019-07-02 |
| 10340247 | Method for forming hybrid bonding with through substrate via (TSV) | — | 2019-07-02 |
| 10340205 | Through substrate vias with improved connections | Ku-Feng Yang | 2019-07-02 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2019-05-21 |
| 10297550 | 3D IC architecture with interposer and interconnect structure for bonding dies | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jiun-Ren Lai, Yung-Chi Lin | 2019-05-21 |
| 10290513 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Shih-Ting Lin, Chen-Hua Yu | 2019-05-14 |
| 10290609 | Semiconductor device and manufacturing method of the same | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2019-05-14 |
| 10290559 | Thermal dissipation through seal rings in 3DIC structure | Shih-Yi Syu | 2019-05-14 |
| 10276516 | Semiconductor package | Chin-Chuan Chang, Jui-Pin Hung | 2019-04-30 |
| 10269589 | Method of manufacturing a release film as isolation film in package | Hsien-Ju Tsou, Chih-Wei Wu, Pu Wang, Szu-Wei Lu, Ying-Ching Shih | 2019-04-23 |
| 10269778 | Package on package (PoP) bonding structures | Jui-Pin Hung, Po-Hao Tsai | 2019-04-23 |
| 10269762 | Rework process and tool design for semiconductor package | Shih-Ting Lin, Justin Huang, Tsung-Fu Tsai, Chen-Hua Yu | 2019-04-23 |
| 10269731 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Chih-Wei Wu, Szu-Wei Lu | 2019-04-23 |
| 10269685 | Interconnect structure for package-on-package devices | Jui-Pin Hung, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2019-04-23 |
| 10269587 | Integrated circuit packages and methods of forming same | Li-Hui Cheng, Po-Hao Tsai | 2019-04-23 |
| 10224293 | Package structure and method for forming the same | Chen-Hua Yu, Tsei-Chung Fu | 2019-03-05 |
| 10204889 | Package structure and method of forming thereof | Po-Hao Tsai | 2019-02-12 |
| 10170341 | Release film as isolation film in package | Li-Hui Cheng, Po-Hao Tsai | 2019-01-01 |
| 10170451 | Semiconductor device method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2019-01-01 |
| 10170441 | Semiconductor structure and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2019-01-01 |
| 10170295 | Flux residue cleaning system and method | I-Ting Chen, Szu-Wei Lu, Ying-Ching Shih | 2019-01-01 |