Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461162 | Transistor device | Jhen-Yu Tsai | 2019-10-29 |
| 10438934 | Package-on-package structure and manufacturing method thereof | Chin-Fu Kao, Jing-Cheng Lin, Li-Hui Cheng, Szu-Wei Lu | 2019-10-08 |
| 10347612 | Solution for reducing poor contact in InFO package | Jing-Cheng Lin, Chen-Hua Yu, Szu-Wei Lu, Shin-Puu Jeng | 2019-07-09 |
| 10325991 | Transistor device | Jhen-Yu Tsai | 2019-06-18 |
| 10290513 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Jing-Cheng Lin, Chen-Hua Yu | 2019-05-14 |
| 10269762 | Rework process and tool design for semiconductor package | Justin Huang, Tsung-Fu Tsai, Jing-Cheng Lin, Chen-Hua Yu | 2019-04-23 |
| 10203252 | Microelectromechanical apparatus having a measuring range selector | Yu-Wen Hsu, Feng-Chia Hsu, Chao-Ta Huang | 2019-02-12 |