Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522470 | Package structure and method of fabricating the same | Jung-Hua Chang | 2019-12-31 |
| 10510591 | Package-on-package structure and method of manufacturing package | Li-Hui Cheng, Chih-Yuan Chien, Szu-Wei Lu | 2019-12-17 |
| 10504824 | Integrated circuit package and method | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2019-12-10 |
| 10438934 | Package-on-package structure and manufacturing method thereof | Shih-Ting Lin, Jing-Cheng Lin, Li-Hui Cheng, Szu-Wei Lu | 2019-10-08 |