Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522470 | Package structure and method of fabricating the same | Chin-Fu Kao | 2019-12-31 |
| 10515923 | Method for forming semiconductor package structure with twinned copper layer | Jing-Cheng Lin, Po-Hao Tsai | 2019-12-24 |