Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461036 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-10-29 |
| 10319683 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu | 2019-06-11 |
| 10297494 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Jing-Cheng Lin +1 more | 2019-05-21 |
| 10290610 | PoP device and method of forming the same | Li-Hsien Huang, An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng +2 more | 2019-05-14 |