Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522473 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-31 |
| 10510562 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2019-12-17 |
| 10373923 | Package with passive devices and method of forming the same | Shuo-Mao Chen, Der-Chyang Yeh | 2019-08-06 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10304801 | Redistribution layers in semiconductor packages and methods of forming same | An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2019-05-28 |
| 10290610 | PoP device and method of forming the same | An-Jhih Su, Der-Chyang Yeh, Hua-Wei Tseng, Li-Hui Cheng, Po-Hao Tsai +2 more | 2019-05-14 |
| 10283479 | Package structures and methods of forming the same | An-Jhih Su, Hsien-Wei Chen | 2019-05-07 |
| 10276549 | Package structure with dummy die | Hsien-Wei Chen | 2019-04-30 |
| 10276542 | Package structure and manufacturing method thereof | An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Jo-Mei Wang, Tien-Chung Yang +1 more | 2019-04-30 |
| 10269752 | Package with UBM and methods of forming | Chen-Hua Yu, Chien-Yu Li, Hung-Jui Kuo, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2019-04-23 |
| 10269723 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2019-04-23 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Lin-Chih Huang, Hsien-Wei Chen, An-Jhih Su | 2019-02-26 |