Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Hung-An Teng, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2019-05-14 |
| 10217687 | Semiconductor device and manufacturing method thereof | Tien-Chung Yang, Hsien-Wei Chen, An-Jhih Su, Li-Hsien Huang | 2019-02-26 |