Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2019-12-17 |
| 10396014 | Robust through-silicon-via structure | Yung-Chi Lin, Wen-Chih Chiou | 2019-08-27 |
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hung-An Teng, Hsin-Yu Chen, Cheng-Chieh Hsieh | 2019-05-14 |