Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290604 | Substrateless integrated circuit packages and methods of forming same | Lin-Chih Huang, Hsin-Yu Chen, Tsang-Jiuh Wu, Cheng-Chieh Hsieh | 2019-05-14 |
HT
Hung-An Teng
Overall (2019): #439,490 of 560,194Top 80%
1
Patents 2019