Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276542 | Package structure and manufacturing method thereof | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen, Hua-Wei Tseng, Tien-Chung Yang +1 more | 2019-04-30 |
| 10177032 | Devices, packaging devices, and methods of packaging semiconductor devices | Hsien-Wei Chen, An-Jhih Su | 2019-01-08 |