Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510604 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Wen-Chih Chiou | 2019-12-17 |
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2019-12-17 |
| 10340205 | Through substrate vias with improved connections | Jing-Cheng Lin | 2019-07-02 |
| 10269761 | Semiconductor device and method | Cheng-Chun Tsai, Hung-Pin Chang, Yi-Hsiu Chen, Wen-Chih Chiou | 2019-04-23 |
| 10170396 | Through via structure extending to metallization layer | Yi-Hsiu Chen, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2019-01-01 |