TF

Tsei-Chung Fu

TSMC: 1 patents #1,597 of 3,065Top 55%
📍 Toufen, TW: #2 of 12 inventorsTop 20%
Overall (2019): #235,601 of 560,194Top 45%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10224293 Package structure and method for forming the same Chen-Hua Yu, Jing-Cheng Lin 2019-03-05