Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297550 | 3D IC architecture with interposer and interconnect structure for bonding dies | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Yung-Chi Lin | 2019-05-21 |
JL
Jiun-Ren Lai
Overall (2019): #416,737 of 560,194Top 75%
1
Patents 2019