Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10518387 | Grinding element, grinding wheel and manufacturing method of semiconductor package using the same | Yi-Chao Mao, Jing-Cheng Lin, Wen-Hua Chang | 2019-12-31 |
| 10347606 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2019-07-09 |
| 10276516 | Semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2019-04-30 |