Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347574 | Integrated fan-out packages | Shin-Puu Jeng, Dai-Jang Chen, Hsien-Wen Liu, Chih-Hsien Lin, Shih-Ting Hung +1 more | 2019-07-09 |
| 10288676 | Circuit test structure | Ching-Fang Chen, Chih-Hsien Lin | 2019-05-14 |
| 10269586 | Package structure and methods of forming same | Bruce C. S. Chou, Chih-Hsien Lin, Jung-Kuo Tu, Tung-Hung Hsieh, Chen-Hua Lin +1 more | 2019-04-23 |