Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2019-04-30 |
CT
Chih-Chiang Tsao
Overall (2019): #506,787 of 560,194Top 95%
1
Patents 2019