Issued Patents 2019
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522652 | Method for fabricating semiconductor device with reduced wafer edge defects | Po-Wen Su, Wei-Chih Lai, Tai-Yen Lin | 2019-12-31 |
| 10522543 | Method for manufacturing gate structure with additional oxide layer | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2019-12-31 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10515900 | Chip package with fan-out structure | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2019-12-24 |
| 10516314 | Slim reel-type brushless motor and insulation seat thereof | Sheng-En Mai, Kun-Fu Chuang | 2019-12-24 |
| 10510697 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2019-12-17 |
| 10510709 | Semicondcutor package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu | 2019-12-17 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10487922 | Horizontal motion mechanism in limited space | Chao-Jung Chen, Chih-Hsiang Lee, Chia-Wei Huang | 2019-11-26 |
| 10470333 | Flexible chassis for different sized sleds | Chao-Jung Chen, Ming-Lun Ku | 2019-11-05 |
| 10468493 | Method for manufacturing gate stack structure | Chun-Ting Chiang, Chi-Ju Lee, Bo SU, Yen-Liang Wu, Wen-Tsung Chang +2 more | 2019-11-05 |
| 10439022 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2019-10-08 |
| 10412851 | Inclined storage array for improved cooling | Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen | 2019-09-10 |
| 10388749 | Manufacturing method of semiconductor device | Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, I-Fan Chang, Chun-Ting Chiang +2 more | 2019-08-20 |
| 10385176 | Transparent polyimide composite film for flexible display and method for manufacturing the same | Chun-Ting Lai | 2019-08-20 |
| 10390454 | Vertical adjustable cable management arm | Chao-Jung Chen, Chih-Hsiang Lee, Wei Yang | 2019-08-20 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10366896 | Semiconductor device and method for fabricating the same | I-Fan Chang, Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, Jie-Ning Yang +4 more | 2019-07-30 |
| 10354965 | Bonding pad process with protective layer | Shih Wei Bih, Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng | 2019-07-16 |
| 10325853 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2019-06-18 |
| 10286029 | Method for treating HCV | Walid M. Awni, Barry M. Bernstein, Andrew L. Campbell, Sandeep Dutta, Wei Liu +4 more | 2019-05-14 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-05-07 |
| 10283470 | Semiconductor package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |