Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490649 | Method of fabricating semiconductor device with adhesion layer | Chun-Chih Lin, Yen-Yu Chen | 2019-11-26 |
| 10446662 | Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrode | Han-Wen Liao, Xuan-You Yan, Yen-Yu Chen, Chun-Chih Lin | 2019-10-15 |
| 10354965 | Bonding pad process with protective layer | Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Wen-Hao Cheng | 2019-07-16 |