Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354965 | Bonding pad process with protective layer | Shih Wei Bih, Chun-Chih Lin, Yen-Yu Chen, Chih-Wei Lin, Wen-Hao Cheng | 2019-07-16 |
SY
Sheng-Wei Yeh
Overall (2019): #269,412 of 560,194Top 50%
1
Patents 2019