Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10354965 | Bonding pad process with protective layer | Shih Wei Bih, Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin | 2019-07-16 |
| 10304178 | Method and system for diagnosing a semiconductor wafer | Peng Chen, Shiang-Bau Wang, Yung-Jung Chang, Wei-Chung Hu, Yi-An Huang +1 more | 2019-05-28 |
| 10168626 | Apparatus and a method of forming a particle shield | Chue-San Yoo, Ching-Yueh Chen | 2019-01-01 |