Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522652 | Method for fabricating semiconductor device with reduced wafer edge defects | Chih-Wei Lin, Wei-Chih Lai, Tai-Yen Lin | 2019-12-31 |
| 10505007 | Semiconductor device having asymmetric work function metal layer | Wen-Yen Huang, Kuan-Ying Lai, Shui-Yen Lu | 2019-12-10 |
| 10483158 | Contact hole structure and method of fabricating the same | Hsuan-Tai Hsu, Kuan Hsuan Ku | 2019-11-19 |
| 10283616 | Fabricating method of semiconductor structure | Wen-Chien Hsieh, En-Chiuan Liou, Chih-Wei Yang, Yu-Cheng Tung | 2019-05-07 |
| 10199260 | Contact hole structure and method of fabricating the same | Hsuan-Tai Hsu, Kuan Hsuan Ku | 2019-02-05 |
| 10177245 | Method of fabricating a semiconductor device | Shui-Yen Lu | 2019-01-08 |