Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10215439 | Rotatable air flow guides for cooling information handling system components | Yenlin WANG, Chih Min Su, Chun-Chin WEN, Hsiang-Jung Chin | 2019-02-26 |
| 10172252 | Information handling system having an ergonomic plunger for a server planar board | Yu-Lin Chen, Liang Ma | 2019-01-01 |