Issued Patents 2019
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Hsiang Chiu, Yao-Tong Lai | 2019-05-07 |
| 10276541 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2019-04-30 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Ching-Yao Lin | 2019-04-30 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2019-04-23 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-04-23 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |
| 10186594 | Semiconductor device having metal gate | Chun-Ting Chiang, Chi-Ju Lee, Bo SU, Yen-Liang Wu, Wen-Tsung Chang +2 more | 2019-01-22 |
| 10170573 | Semiconductor device and fabrication method thereof | Chun-Ting Chiang, Jie-Ning Yang, Chi-Ju Lee, Bo SU, Yen-Liang Wu +3 more | 2019-01-01 |