Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515900 | Chip package with fan-out structure | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2019-12-24 |
| 10475764 | Die bonder and methods of using the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2019-11-12 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Ai-Tee Ang, Ching-Hua Hsieh, Chih-Wei Lin, Ching-Yao Lin | 2019-04-30 |