Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510716 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng | 2019-12-17 |
| 10468478 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hui-Chi Chen, Dian-Hau Chen +1 more | 2019-11-05 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-05-07 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2019-04-23 |