Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319691 | Solderless interconnection structure and method of forming same | Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2019-06-11 |
YL
Yu-Wei Lin
Overall (2019): #205,606 of 560,194Top 40%
1
Patents 2019