Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515919 | Bump-on-trace design for enlarge bump-to-trace distance | Tin-Hao Kuo, Chen-Shien Chen | 2019-12-24 |
| 10504856 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2019-12-10 |
| 10388620 | Connector structure and method of forming same | Chen-Shien Chen, Mirng-Ji Lii, Chita Chuang | 2019-08-20 |
| 10319691 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2019-06-11 |
| 10319695 | Semiconductor device and bump formation process | Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2019-06-11 |
| 10290600 | Dummy flip chip bumps for reducing stress | Tin-Hao Kuo, Chita Chuang, Chen-Shien Chen | 2019-05-14 |