Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2019-12-24 |
| 10483225 | Packaging assembly and method of making the same | Yao-Chun Chunag, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2019-11-19 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2019-11-05 |
| 10388620 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2019-08-20 |
| 10290600 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2019-05-14 |