Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468366 | Bonded structures for package and substrate | Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |
MC
Ming-Hong Cha
Overall (2019): #346,283 of 560,194Top 65%
1
Patents 2019