Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Chita Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2019-12-24 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2019-11-05 |