Issued Patents 2019
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522481 | Post-passivation interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu | 2019-12-31 |
| 10510731 | Package-on-package (PoP) structure including stud bulbs | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2019-12-17 |
| 10388620 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Chita Chuang | 2019-08-20 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee, Jiun Yi Wu | 2019-07-16 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Yung-Ping Chiang, Chao-Wen Shih, Hao-Yi Tsai | 2019-06-11 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Yu-Min Liang, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10319695 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2019-06-11 |
| 10312204 | System and method for an improved interconnect structure | Hsien-Wei Chen, Hao-Yi Tsai, Chen-Hua Yu, Tsung-Yuan Yu | 2019-06-04 |
| 10276525 | Package structure and method of fabricating the same | Ching-Wen Hsiao, Chen-Shien Chen, Kuo-Ching Hsu | 2019-04-30 |
| 10269489 | Programmable inductor | Chen-Hua Yu, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2019-04-23 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu, Min-Chien Hsiao +1 more | 2019-04-23 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Meng-Tse Chen, Wei-Hung Lin | 2019-01-08 |