Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Jung Wei Cheng, Chien-Hsun Lee | 2019-12-31 |
| 10522495 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2019-12-31 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |
| 10276508 | Semiconductor packages and methods of forming the same | Kuan-Lin Ho, Chin-Liang Chen, Chi-Yang Yu | 2019-04-30 |
| 10269679 | Semiconductor structure and associated method for manufacturing the same | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2019-04-23 |