Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522486 | Connector formation methods and packaged semiconductor devices | Jung Wei Cheng, Hai-Ming Chen, Hao-Cheng Hou, Hung-Jen Lin, Chun-Chih Chuang +2 more | 2019-12-31 |
| 10522436 | Planarization of semiconductor packages and structures resulting therefrom | Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng | 2019-12-31 |
| 10515931 | System in package and method of fabricating same | Tsung-Ding Wang | 2019-12-24 |
| 10483132 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang | 2019-11-19 |
| 10461022 | Semiconductor package structure and manufacturing method thereof | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2019-10-29 |
| 10354983 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2019-07-16 |
| 10319607 | Package-on-package structure with organic interposer | Jiun Yi Wu, Yu-Min Liang, Mirng-Ji Lii, Tsung-Ding Wang, Jung Wei Cheng | 2019-06-11 |