Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504865 | Package structure and method of manufacturing the same | Ming-Kai Liu, Han-Ping Pu, Ting-Chu Ko, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Chao-Wen Shih, Hao-Yi Tsai, Mirng-Ji Lii | 2019-06-11 |
| 10312203 | Structure and formation method of chip package with antenna element | Nien-Fang Wu, Min-Chien Hsiao, Yi-Che Chiang, Chao-Wen Shih, Shou-Zen Chang +2 more | 2019-06-04 |