Issued Patents 2019
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515956 | Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2019-12-24 |
| 10510714 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2019-12-17 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10483617 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2019-11-19 |
| 10475757 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Nan-Chin Chuang | 2019-11-12 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2019-07-16 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Yi-Che Chiang, Chao-Wen Shih +2 more | 2019-06-04 |
| 10304790 | Method of fabricating an integrated fan-out package | Chung-Hao Tsai, Chuei-Tang Wang, Kai-Chiang Wu, Ming-Kai Liu | 2019-05-28 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2019-04-30 |
| 10183858 | Semiconductor structure and method of manufacturing the same | Albert Wan, Yu-Sheng Hsieh, Chao-Wen Shih, Chung-Shi Liu, Chen-Hua Yu | 2019-01-22 |
| 10186492 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Nan-Chin Chuang | 2019-01-22 |