Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang | 2019-12-31 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ming-Kai Liu +5 more | 2019-12-17 |
| 10468355 | EMI Shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Meng-Tse Chen | 2019-11-05 |
| 10312112 | Integrated fan-out package having multi-band antenna and method of forming the same | Nan-Chin Chuang, Kai-Chiang Wu | 2019-06-04 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2019-06-04 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |