Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu | 2019-12-17 |
| 10483617 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2019-11-19 |
| 10475757 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2019-11-12 |
| 10312112 | Integrated fan-out package having multi-band antenna and method of forming the same | Ching-Feng Yang, Kai-Chiang Wu | 2019-06-04 |
| 10186492 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2019-01-22 |