Issued Patents 2019
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2019-12-31 |
| 10510714 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2019-12-17 |
| 10510693 | Semiconductor package structure | Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang | 2019-12-17 |
| 10510689 | Solder ball protection in packages | Chia-Chun Miao, Shih-Wei Liang | 2019-12-17 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10468355 | EMI Shielding structure in InFO package | Chen-Hua Yu, Ching-Feng Yang, Meng-Tse Chen | 2019-11-05 |
| 10461034 | Package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2019-10-29 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih +2 more | 2019-08-13 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2019-07-16 |
| 10347563 | Barrier structures between external electrical connectors | Chia-Chun Miao, Shih-Wei Liang | 2019-07-09 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2019-06-04 |
| 10312112 | Integrated fan-out package having multi-band antenna and method of forming the same | Nan-Chin Chuang, Ching-Feng Yang | 2019-06-04 |
| 10304790 | Method of fabricating an integrated fan-out package | Shou-Zen Chang, Chung-Hao Tsai, Chuei-Tang Wang, Ming-Kai Liu | 2019-05-28 |
| 10276404 | Integrated fan-out package | Chung-Hao Tsai, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2019-04-30 |
| 10269640 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Ming-Kai Liu | 2019-04-23 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |