Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510689 | Solder ball protection in packages | Shih-Wei Liang, Kai-Chiang Wu | 2019-12-17 |
| 10418408 | Curved image sensor using thermal plastic substrate material | Yuanwei Zheng, Gang Chen, Yin Qian, Duli Mao, Dyson H. Tai +1 more | 2019-09-17 |
| 10347563 | Barrier structures between external electrical connectors | Kai-Chiang Wu, Shih-Wei Liang | 2019-07-09 |
| 10297627 | Chip scale package for an image sensor | Yin Qian, Chen Lu, Jin Li, Ming Zhang, Dyson H. Tai | 2019-05-21 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu +1 more | 2019-04-23 |
| 10211243 | Edge reflection reduction | Yin Qian, Chao-Hung Lin, Chen Lu, Dyson H. Tai, Ming Zhang +1 more | 2019-02-19 |