Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522437 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2019-12-31 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang | 2019-12-17 |
| 10510714 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2019-12-17 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chao-Wen Shih, Han-Ping Pu +2 more | 2019-08-13 |
| 10276404 | Integrated fan-out package | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2019-04-30 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |