Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510478 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-12-17 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Chen-Hua Yu, Ching-Feng Yang, Ming-Kai Liu +5 more | 2019-12-17 |
| 10510714 | Packaged semiconductor devices and packaging methods | Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2019-12-17 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Chuei-Tang Wang, Hao-Yi Tsai, Ming Hung Tseng, Chieh-Yen Chen +1 more | 2019-04-23 |