Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510478 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2019-12-17 |
| 10497646 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu | 2019-12-03 |
| 10475755 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2019-11-12 |
| 10304614 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2019-05-28 |
| 10269481 | Stacked coil for wireless charging structure on InFO package | Chen-Hua Yu, Tzu-Chun Tang, Chuei-Tang Wang, Hao-Yi Tsai, Chieh-Yen Chen +1 more | 2019-04-23 |
| 10269773 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2019-04-23 |
| 10269702 | Info coil structure and methods of manufacturing same | Chen-Hua Yu, Tsung-Hsien Chiang, Hao-Yi Tsai, Hung-Yi Kuo | 2019-04-23 |
| 10269676 | Thermally enhanced package-on-package (PoP) | Tsung-Hsien Chiang, Chen-Shien Chen | 2019-04-23 |