Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497646 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2019-12-03 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Wei Chen, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2019-07-16 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Ching-Jung Yang, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |