Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504873 | 3DIC structure with protective structure and method of fabricating the same and package | Hsien-Wei Chen, Ming-Fa Chen | 2019-12-10 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Tung-Liang Shao, Yu-Chia Lai | 2019-07-16 |
| 10276496 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2019-04-30 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Shih-Wei Liang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |
| 10262958 | Package with solder regions aligned to recesses | Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai, Tung-Liang Shao | 2019-04-16 |
| 10170444 | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices | Yen-Ping Wang | 2019-01-01 |