Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468385 | Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof | Wei-Heng Lin, Chih-Hang Tung, Chen-Hua Yu | 2019-11-05 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2019-07-16 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2019-04-16 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Yi-Li Hsiao, Hsiao-Yun Chen, Chih-Hang Tung, Chen-Hua Yu | 2019-03-12 |