Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522491 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2019-12-31 |
| 10468385 | Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chen-Hua Yu | 2019-11-05 |
| 10460987 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chen-Hua Yu | 2019-10-29 |
| 10319690 | Semiconductor structure and manufacturing method thereof | Wen-Shiang Liao, Chewn-Pu Jou, Chen-Hua Yu | 2019-06-11 |
| 10290611 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2019-05-14 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Tung-Liang Shao, Yi-Li Hsiao, Hsiao-Yun Chen, Chen-Hua Yu | 2019-03-12 |