Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522491 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2019-12-31 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Tung-Liang Shao, Hsiao-Yun Chen, Chih-Hang Tung, Chen-Hua Yu | 2019-03-12 |